Precision assembly technologies and systems : 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012 : proceedings /
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| Meeting name: | IFIP TC5 WG5.5 International Precision Assembly Seminar (6th : 2012 : Chamonix, France) |
|---|---|
| Imprint: | Heidelberg ; New York : Springer, ©2012. |
| Description: | 1 online resource (xi, 212 pages) : illustrations. |
| Language: | English |
| Series: | IFIP advances in information and communication technology, 1868-4238 ; 371 IFIP advances in information and communication technology ; 371. |
| Subject: | |
| Format: | E-Resource Book |
| URL for this record: | http://pi.lib.uchicago.edu/1001/cat/bib/11076571 |
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| 111 | 2 | |a IFIP TC5 WG5.5 International Precision Assembly Seminar |n (6th : |d 2012 : |c Chamonix, France) | |
| 245 | 1 | 0 | |a Precision assembly technologies and systems : |b 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012 : proceedings / |c Svetan Ratchev (ed.). |
| 246 | 3 | |a IPAS 2012 | |
| 260 | |a Heidelberg ; |a New York : |b Springer, |c ©2012. | ||
| 300 | |a 1 online resource (xi, 212 pages) : |b illustrations. | ||
| 336 | |a text |b txt |2 rdacontent |0 http://id.loc.gov/vocabulary/contentTypes/txt | ||
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| 490 | 1 | |a IFIP advances in information and communication technology, |x 1868-4238 ; |v 371 | |
| 504 | |a Includes bibliographical references and author index. | ||
| 505 | 0 | 0 | |t Development of a Micro-scale Assembly Facility with a Three Fingered, Self-aware Assembly Tool and Electro-chemical Etching Capabilities -- |t Semi-automated Assembly of a MEMS-Based Micro-scale CMM Probe and Future Optimization of the Process Chain with a View to Desktop Factory Automation -- |t Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench -- |t Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment -- |t Processes for the Self-assembly of Micro Parts -- |t Precisely Assembled Multi Deflection Arrays -- Key Components for Multi Shaped Beam Lithography -- |t Construction Kit for Miniaturised Handling Systems: Further Developments and First Applications -- |t Flexible Gripper System for Small Optical Assemblies -- Final Tests and Findings -- |t Handling and Manipulation of Microcomponents: Work-Cell Design and Preliminary Experiments -- |t Adhesive Workpiece Fixturing for Micromachining -- |t Dual-Stage Feed Drive for Precision Positioning on Milling Machine -- |t High Resolution Actuators for Severe Environments -- |t Tolerance Management for Assembly -- Not a Matter of Product Size -- |t Modelling and Analysis of the Geometrical Errors of a Parallel Manipulator Micro-CMM -- |t Methods for Implementing Compensation Strategies in Micro Production Systems Supported by a Simulation Approach -- |t Accuracy Measurements of Miniature Robot Using Optical CMM -- |t A System for the Quality Inspection of Surfaces of Watch Parts -- |t Characterisation of High Accuracy, Feedback Controlled, Adhesive Bonding -- |t Towards Intelligent Assembly and Manufacturing Environment -- Modular ICT Support for Holonic Manufacturing System -- |t Enabling Fast Ramp-Up of Assembly Lines through Context-Mapping of Implicit Operator Knowledge and Machine-Derived Data -- |t Accelerated Ramp-Up of Assembly Systems through Self-learning -- |t A Methodology for Assessing the Cost Effectiveness of Assembly Processes -- |t Model Based Planning of Complex Micro-manufacturing Strategies -- |t Towards an European Approach for Characterisation of Multimaterial Micromanufacturing Process Capabilities. |
| 520 | |a This book constitutes the refereed proceedings of the 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, held in Chamonix, France, in February 2012. The 15 revised full papers were carefully reviewed and selected from numerous submissions. The papers are organized into the following topical sections: micro processes and systems; handling and manipulation in assembly; tolerance management and error compensation methods; metrology and quality control; intelligent control of assembly systems; and process selection and modelling techniques. | ||
| 650 | 0 | |a Assembly-line methods |v Congresses. | |
| 650 | 0 | |a Automation |v Congresses. |0 http://id.loc.gov/authorities/subjects/sh2007101727 | |
| 650 | 0 | |a Machining |x Automatic control |v Congresses. | |
| 650 | 0 | |a Microelectromechanical systems |v Congresses. |0 http://id.loc.gov/authorities/subjects/sh2008107748 | |
| 650 | 7 | |a Informatique. |2 eclas | |
| 653 | 4 | |a Computer science. | |
| 653 | 4 | |a Computer simulation. | |
| 653 | 4 | |a Engineering. | |
| 653 | 4 | |a Machinery. | |
| 653 | 4 | |a Electronics. | |
| 653 | 4 | |a Simulation and Modeling. | |
| 653 | 4 | |a Nanotechnology and Microengineering. | |
| 653 | 4 | |a Manufacturing, Machines, Tools. | |
| 653 | 4 | |a Electronics and Microelectronics, Instrumentation. | |
| 655 | 4 | |a Electronic books. | |
| 650 | 7 | |a Assembly-line methods. |2 fast |0 http://id.worldcat.org/fast/fst00819017 | |
| 650 | 7 | |a Automation. |2 fast |0 http://id.worldcat.org/fast/fst00822786 | |
| 650 | 7 | |a Microelectromechanical systems. |2 fast |0 http://id.worldcat.org/fast/fst01019745 | |
| 655 | 7 | |a Conference papers and proceedings. |2 fast |0 http://id.worldcat.org/fast/fst01423772 | |
| 700 | 1 | |a Ratchev, Svetan. |0 http://id.loc.gov/authorities/names/nb2006005333 |1 http://viaf.org/viaf/11827869 | |
| 776 | 0 | 8 | |i Printed edition: |z 9783642281624 |
| 830 | 0 | |a IFIP advances in information and communication technology ; |v 371. | |
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