Packaging of high power semiconductor lasers /

Packaging of high power semiconductor lasers /

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Bibliographic Details
Imprint:	New York : Springer, 2014.
Description:	1 online resource.
Language:	English
Series:	Micro- and opto-electronic materials, structures, and systems Micro- and opto-electronic materials, structures, and systems.
Subject:	Semiconductor lasers. Electronic packaging. Electronic packaging. Semiconductor lasers.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/11086486

Hidden Bibliographic Details
Other authors / contributors:	Liu, Hui, author. Liu, Xingsheng, author. Xiong, Linling, author. Zhao, Wei, Ph.D., author.
ISBN:	9781461492634 1461492637 9781461492627
Notes:	Includes bibliographical references and index. Print version record.
Summary:	This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
Other form:	Print version: Packaging of high power semiconductor lasers 9781461492627
Standard no.:	10.1007/978-1-4614-9263-4

Description
Summary:	This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Physical Description:	1 online resource.
Bibliography:	Includes bibliographical references and index.
ISBN:	9781461492634 1461492637 9781461492627