Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method /

Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method /

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Bibliographic Details
Author / Creator:	Seok, Seonho, author.
Imprint:	Cham : Springer International Publishing, [2018]
Description:	1 online resource (viii, 115 pages) : 106 illustrations
Language:	English
Series:	Springer Series in Advanced Manufacturing, 1860-5168 Springer series in advanced manufacturing,
Subject:	Microelectronic packaging. Microelectromechanical systems. Coatings. Corrosion and anti-corrosives. Engineering. Machinery. Manufacturing industries. Materials science. Nanotechnology. Tools. Tribology.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/11654668

Hidden Bibliographic Details
ISBN:	9783319778723 3319778722 9783319778716 3319778714
Digital file characteristics:	text file PDF
Notes:	Includes bibliographical references.
Summary:	This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) ( -MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
Other form:	Print version: Seok, Seonho. Advanced packaging and manufacturing technology based on adhesion engineering. Cham: Springer International Publishing, [2018] 9783319778716
Standard no.:	10.1007/978-3-319-77872-3

Table of Contents:

Overview of MEMS packaging technologies
Adhesion control techniques for debonding
FEM modeling of debonding
Polymer cap transfer packaging technologies
Thin film cap transfer packaging technology
Other related manufacturing technologies.