Microelectronic ultrasonic bonding.
Saved in:
Author / Creator: | Harman, George G. |
---|---|
Imprint: | [Washington] U.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.] 1974. |
Description: | vi, 102 p. illus. 26 cm. |
Language: | English |
Series: | NBS special publication 400-2 Semiconductor measurement technology |
Subject: | |
Format: | U.S. Federal Government Document Print Book |
URL for this record: | http://pi.lib.uchicago.edu/1001/cat/bib/268832 |
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100 | 1 | |a Harman, George G. |0 http://id.loc.gov/authorities/names/n80019646 |1 http://viaf.org/viaf/91671255 | |
245 | 1 | 0 | |a Microelectronic ultrasonic bonding. |c George G. Harman, editor. |
260 | 0 | |a [Washington] |b U.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.] |c 1974. | |
300 | |a vi, 102 p. |b illus. |c 26 cm. | ||
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350 | |a $1.25 | ||
440 | 0 | |a NBS special publication |v 400-2 | |
440 | 0 | |a Semiconductor measurement technology | |
500 | |a "CODEN: XNBSAV." | ||
504 | |a Includes bibliographical references. | ||
650 | 0 | |a Ultrasonic welding |0 http://id.loc.gov/authorities/subjects/sh85139493 | |
650 | 0 | |a Microelectronics |0 http://id.loc.gov/authorities/subjects/sh85084822 | |
650 | 7 | |a Microelectronics. |2 fast |0 http://id.worldcat.org/fast/fst01019757 | |
650 | 7 | |a Ultrasonic welding. |2 fast |0 http://id.worldcat.org/fast/fst01160717 | |
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927 | |t Library of Congress classification |a QC100.U524 no.400-2 |l ASR |c ASR-SciASR |g Analytic |e CRERAR |b A13101454 |i 869316 |