Advanced integrated communication microsystems /

Advanced integrated communication microsystems /

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Bibliographic Details
Imprint:Hoboken, N.J. : IEEE Press : Wiley, c2009.
Description:1 online resource (xix, 473 p.) : ill.
Language:English
Subject:
Radio -- Transmitters and transmission.
Radio -- Receivers and reception.
Radio frequency integrated circuits.
Wireless communication systems -- Equipment and supplies.
Radio frequency integrated circuits.
Radio -- Receivers and reception.
Radio -- Transmitters and transmission.
Wireless communication systems -- Equipment and supplies.
Format: E-Resource Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/8680212
Hidden Bibliographic Details
Other authors / contributors:Laskar, Joy.
ISBN:9780470409787 (electronic bk.)
0470409789 (electronic bk.)
9780470409794 (electronic bk.)
0470409797 (electronic bk.)
9780471709602 (cloth)
0471709603 (cloth)
Notes:Includes bibliographical references and index.
Description based on print version record.
Other form:Print version: Advanced integrated communication microsystems. Hoboken, N.J. : IEEE Press : Wiley, c2009 9780471709602 0471709603
Standard no.:10.1002/9780470409794
Table of Contents:
  • Preface
  • Acknowledgements
  • Chapter 1. Fundamentals of Communication Systems
  • Introduction
  • 1.1. Communication systems
  • 1.2. History and Overview of Wireless Communication Systems
  • 1.3. History and Overview of Wired Communication Systems
  • 1.4. Communication System Fundamentals
  • 1.5. Electromagnetics
  • 1.6. Analysis of circuits and systems
  • 1.7. Broadband,wideband and narrowband systems
  • 1.8. Semiconductor technology and devices
  • 1.9. Key circuit topologies
  • 1.10. Gain/Linearity/Noise
  • Conclusion
  • Chapter 2. Wireless Communication Systems Architectures
  • Introduction
  • 2.1. Fundamental considerations
  • 2.2. Link Budget Analysis
  • 2.3. Propagation Effects
  • 2.4. Interface Planning
  • 2.5. Superheterodyne architecture
  • 2.6. Low IF architecture
  • 2.7. Direct conversion architecture
  • 2.8. Two stage direct conversion
  • 2.9. Current mode architecture
  • 2.10. Subsampling architecture
  • 2.11. Multi-band direct conversion radio
  • 2.12. Polar modulator
  • 2.13. Harmonic reject architectures
  • 2.14. Practical considerations for transceiver integration
  • Conclusion
  • Chapter 3. Systems Architectures for High Speed Wired Communications.
  • 3.1. Introduction
  • 3.2. Band-limited channel
  • 3.3. Equalizer system study
  • References
  • Chapter 4. Mixed Signal Communication Systems Building Blocks.
  • Introduction
  • 4.1. Inverters
  • 4.2. Static D flipflop
  • 4.3. Bias circuits
  • 4.4. Transconductor cores
  • 4.5. Load networks
  • 4.6. A versatile analog signal processing core
  • 4.7. Low noise amplifier
  • 4.8. Power amplifiers
  • 4.9. Balun
  • 4.10. Signal Generation Path
  • 4.11. Mixers
  • 4.12. Baseband filters
  • 4.13. Signal strength indicator (SSI)
  • 4.14. ADC/DAC
  • Conclusion
  • Chapter 5. Examples of Integrated Communication Microsystems.
  • Introduction
  • 5.1. Direct conversion receiver front-end
  • 5.2. Debugging: A practical scenario
  • 5.3. High speed wired communication example
  • Conclusion
  • References
  • Chapter 6. Low voltage, low power and low area designs
  • Introduction
  • 6.1. Power consumption considerations
  • 6.2. Device technology and scaling
  • 6.3. Low voltage design techniques
  • 6.4. Injection locked techniques
  • 6.5. Subharmonic architectures
  • 6.6. Superregenerative architectures
  • 6.7. Hearing aid applications
  • 6.8. Radio frequency identification tags
  • 6.9. Ultra low power radios
  • Conclusion
  • References
  • Chapter 7. Packaging for Integrated Communication Microsystems
  • Introduction
  • 7.1. Background
  • 7.2. Elements of a package
  • 7.4. Driving Forces for RF Packaging Technology
  • 7.5. MCM Definitions and Classifications
  • 7.6. RF - SOP modules
  • 7.7. Package modeling and optimization
  • 7.8. Future packaging trends
  • 7.9. Chip Package Co-design
  • 7.10. Package models and transmission lines
  • 7.11. Calculations for package elements
  • 7.12. Cross-talk
  • 7.13. Grounding
  • 7.14. Practical issues in working with packages
  • 7.15. Chip-package codesign examples
  • 7.16. Wafer scale package
  • 7.17. Filters using bondwire
  • 7.18. Packaging Limitation
  • Conclusion
  • References
  • Chapter 8. Advanced SOP Components and Signal Processing.
  • Introduction
  • 8.1. History of compact design
  • 8.2. Previous Techniques in Performance Enhancement
  • 8.3. Design Complexities
  • 8.4. Modeling Complexities
  • 8.5. Compact Stacked Patch Antennas Using LTCC Multilayer Technology
  • 8.6. Suppression of Surface Waves and Radiation Pattern Improvement Using SHS Technology
  • 8.7. Radiation-Pattern Improvement Using a Compact Soft Surface Structure
  • 8.8. A Package-Level Integrated Antenna Based on LTCC Technology
  • Chapter 9. Characterization and Computer aided analysis of integrated microsystems
  • Introduction
  • 9.1. Computer aided analysis of wireless systems
  • 9.2. Measurement equipments and their operation
  • 9.3. Network analyzer calibration
  • 9.4. Wafer probing measurement
  • 9.5. Characterization of integrated radios
  • 9.6. In the laboratory

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