Advances in cryogenic engineering : transactions of the International Cryogenic Materials Conference -- ICMC ; Spokane, Washington, USA ; 13-17 June 2011 /

Advances in cryogenic engineering : transactions of the International Cryogenic Materials Conference -- ICMC ; Spokane, Washington, USA ; 13-17 June 2011 /

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Bibliographic Details
Meeting name:	International Cryogenic Materials Conference (2011 : Spokane, Wash.)
Imprint:	Melville, N.Y. : American Institute of Physics, 2012.
Description:	1 online resource xi, 416 pages) : illustrations (some color).
Language:	English
Series:	Advances in cryogenic engineering ; v. 58 AIP conference proceedings, 0094-243X ; 1435 Advances in cryogenic engineering ; 58. AIP conference proceedings ; no. 1435.
Subject:	Low temperature engineering -- Congresses. Low temperature engineering. Conference papers and proceedings.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/8831008

Hidden Bibliographic Details
Varying Form of Title:	Transactions of the International Cryogenic Materials Conference
Other authors / contributors:	Balachandran, U.
ISBN:	9780735410220 0735410224
Notes:	Includes bibliographical references and index. Online resource; title from PDF title page (AIP Web site, viewed June 12, 2012).

Description
Summary:	Papers published in this volume cover the physical and mechanical properties of metals and alloys at cryogenic temperatures, insulation materials used in magnets for large-scale applications, recent developments in the conventional low-temperature superconductors, YBCO coated conductors, Bi- based superconductors, and MgB2 conductors.
Physical Description:	1 online resource xi, 416 pages) : illustrations (some color).
Bibliography:	Includes bibliographical references and index.
ISBN:	9780735410220 0735410224
ISSN:	0094-243X ;