Diffusion processes in advanced technological materials /

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Bibliographic Details
Imprint:Norwich, N.Y. : William Andrew Pub., c2005.
Description:1 online resource (xviii, 532 p.) : ill.
Language:English
Subject:
Format: E-Resource Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/8877299
Hidden Bibliographic Details
Other authors / contributors:Gupta, D.
ISBN:9783540274704
3540274707
9780815516897 (electronic bk.)
0815516894 (electronic bk.)
Notes:Includes bibliographical references and index.
Description based on print version record.
Summary:Internationally recognized experts document diffusion processes and various other properties operative in advanced technological materials.
Other form:Print version: Diffusion processes in advanced technological materials. Norwich, N.Y. : William Andrew Pub., c2005 0815515014 9780815515012
Table of Contents:
  • Copyright Page; Front Cover; Diffusion Processes in Advanced Technological Materials; Contents; Contributors; Preface; Chapter 1. Diffusion in Bulk Solids and Thin Films: Some Phenomenological Examples; Chapter 2. Solid State Diffusion and Bulk Properties; Chapter 3. Atomistic Computer Simulation of Diffusion; Chapter 4. Bulk and Grain Boundary Diffusion in Intermetallic Compounds; Chapter 5. Diffusion Barriers in Semiconductor Devices/Circuits; Chapter 6. Reactive Phase Formation: Some Theory and Applications; Chapter 7. Metal Diffusion in Polymers and on Polymer Surfaces