Advances in cryogenic engineering : proceedings of the International Cryogenic Materials Conference (ICMC), Madison, Wisconsin, 16-20 July 2001 /

Saved in:

Bibliographic Details
Meeting name:	International Cryogenic Materials Conference (2001 : Madison, Wis.)
Imprint:	Melville, N.Y. : American Institute of Physics, 2002.
Description:	1 online resource (2 volumes (xxiii, xvii, 1798 pages)) : illustrations.
Language:	English
Series:	AIP conference proceedings ; v. 614 AIP conference proceedings ; v. 614.
Subject:	Low temperature engineering -- Congresses. Low temperature engineering -- Materials -- Congresses. Materials science -- Congresses. Low temperature engineering. Materials science. Conference papers and proceedings.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/11321731

Hidden Bibliographic Details
Other authors / contributors:	Balachandran, U. Gubser, D. U. (Donald Urban), 1940- Hartwig, K. Ted.
ISBN:	0735400601 9780735400603
Notes:	Title from PDF title page (AIP website, viewed on September 15, 2008). "The 2001 Joint Cryogenic Engineering Conference and International Cryogenic Materials Conference were held in Madison, Wisconsin, USA from July 16th to 20th."--Vol. 1, p. xix. Includes bibliographical references and index.
Summary:	Annotation Covers the development and properties of insulation and structural materials used to construct cryogenic devices and for cryogenic application. Also deals with the study of low and high temperature superconducting materials that are used in wire form for conductor applications such as cables for high field magnets, motors, transmission lines, transformers, and fault current limiters, for thin film applications in electronic devices, and bulk form for levitation and applications.
Other form:	Print version: International Cryogenic Materials Conference (2001 : Madison, Wis.). Advances in cryogenic engineering. Melville, N.Y. : American Institute of Physics, 2002 0735400601

Similar Items