Thermal expansion--1973 /

Thermal expansion--1973 /

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Bibliographic Details
Meeting name:International Symposium on Thermal Expansion of Solids (1973 : Lake Ozark, Mo.)
Imprint:New York, American Institute of Physics, 1974.
Description:304 pages illustrations 25 cm.
Language:English
Series:AIP conference proceedings, 1551-7616 ; no. 17
AIP conference proceedings ; no. 17.
Subject:
Materials -- Thermal properties -- Congresses.
Solids -- Thermal properties -- Congresses.
Expansion (Heat) -- Congresses.
Expansion (Heat)
Materials -- Thermal properties.
Solids -- Thermal properties.
Conference papers and proceedings.
Format: E-Resource Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/11321949
Hidden Bibliographic Details
Other authors / contributors:Taylor, R. E. (Raymond Ellory), editor.
Denman, G. L., editor.
Purdue University. Thermophysical Properties Research Center.
Air Force Materials Laboratory (U.S.)
ISBN:0883181169
9780883181164
Notes:"Under the co-sponsorship of the Thermophysical Properties Research Center, Purdue University, and the Air Force Materials Laboratory, Wright-Patterson Air Force Base, Ohio."
Includes bibliographical references.
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