Ultra clean processing of semiconductor surfaces XIV : 14th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (14th UCPSS 2018) held in Bruges, Belgium, September 22-24, 2008 /
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| Meeting name: | International Symposium on Ultra Clean Processing of Semiconductor Surfaces (14th : 2018 : Leuven, Belgium), author. |
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| Imprint: | Stafa-Zuerich, Switzerland : Trans Tech Publications Ltd, [2018] |
| Description: | 1 online resource : color illustrations |
| Language: | English |
| Subject: | |
| Format: | E-Resource Book |
| URL for this record: | http://pi.lib.uchicago.edu/1001/cat/bib/12021451 |
Table of Contents:
- Industry Context for Semiconductor Wet Etch and Surface Preparation
- Surface Recombination Velocity Imaging of HF-Etched Si Wafers Using Dynamic Heterodyne Lock-In Carrierography
- Organic Material Removal by Thermally Activated Ozone Gas
- Carbon Removal and Native Oxide Cleaning on Si and SiGe Surfaces in Previum Chamber
- Vapor-Phase Deposition of N3-Containing Monolayers on SiO2 and Si3N4 for Wafer Scale Biofunctionalization
- Toward the Surface Preparation of InGaAs for the Future CMOS Integration
- Effect of WET treatment on Group III-V Compound Semiconductor Surface
- Nanoscale Etching of GaAs and InP in Acidic H2O2 Solution: A Striking Contrast in Kinetics and Surface Chemistry
- Ion Implanted Photoresist Removal by Material Loss-Free Organic Solvent
- Removal of CrN Contamination from EUV Mask Backside Using Dry Cleaning
- Damage-Free Cleaning of Advanced Structure Using Timely Energized Bubble Oscillation Megasonic Technology
- An Observation Method of Real Contact Area during PVA Brush Scrubbing
- Electrostatic Discharge Control and Visualization in Spray Nozzle
- Behavior Analysis of Si Etching Process with HF/HNO3 Mixture in Single-Spin Wafer Process
- Study of the Anisotropic Wet Etching of Nanoscale Structures in Alkaline Solutions
- Unexpected Pyramid Texturization of n-Type Ge (100) via Electrochemical Etching: Bridging Surface Chemistry and Morphology
- Selective Wet Etching in Fabricating SiGe and Ge Nanowires for Gate-all-Around MOSFETs
- SiGe vs. Si Selective Wet Etching for Si Gate-all-Around
- A New Method to Fabricate Ge Nanowires: Selective Lateral Etching of Gesn:P/Ge Multi-Stacks
- Customized Chemical Compositions Adaptable for Cleaning Virtually all Post-Etch Residues
- Low Temperature SiGe Steam Oxide - Aqueous Hf and NH3/NF3 Remote Plasma Etching and its Implementation as Si GAA Inner Spacer
- RMG Patterning by Digital Wet Etching of Polycrystalline Metal Films
- Wet Etchants Penetration through Photoresist during Wet Patterning
- Is Highly Selective Si3N4/SiO2 Etching Feasible without Phosphoric Acid?
- Self-Aligned Contacting Processes for the 80 nm p-MTJ Device Fabrication by Wet Approach
- Drying Stability and Critical Height of Repeating Line/Space Structures
- Fixed Charge Control of Silylated Surface for Stiction-Free Drying with Surface Energy Reduction Process
- Exploring Wetting Dynamics on Superhydrophobic Nanopatterned Surfaces Using ATR-FTIR
- Effect of 1-D Nano-Confinement on the Kinetics of a Click-Chemistry Surface Reaction Used in Biosensors
- Cleaning of High Aspect Ratio STI Structures for Advanced Logic Devices by Implementation of a Surface Modification Drying Technique
- Pattern Collapse-Free Drying with Sacrificial Gap Fill Polymers
- Factors Influencing Drying Induced Pattern Collapse
- 300 mm Wafer Development for Pattern Collapse Evaluations
- AlCu Pitting Prevention in Post Etch Cleaning
- Investigation of Defectivity Coming from the Back Side of Wafers during AlCu Polymer Removal Processes Performed in a Batch Spray Tool
- Aluminum Cleaning on Single Wafer Tool: A Case Study with Diluted HF
- Atomic Layer Deposition of TiN below 600 K Using N2H4
- Process Parameter Control for BEOL TiN Hard Mask Etch-Back
- BEOL Post-Etch Clean Robustness Improvement with Ultra-Diluted Hf for 28nm Node
- Optimization of Wet Strip for Metal Void Reduction in Trench First Metal Hard Mask Back End of Line Process
- Corrosion of Co in BEOL interconnects in dilute HF solution
- Effect of Cleaning Chemistries on Cobalt: Surface Chemistries and Electrical Characterization
- Optimization of Post Etch Cobalt Compatible Clean by pH and Oxidizer
- Developing Integrated Solutions and Wet Cleans to Eliminate Tungsten Contact Attack in Sub 0x nm Nodes
- Post-CMP Cleaners for Tungsten Advanced Nodes: 10nm and 7nm
- Wet-Chemical Etching of Ruthenium in Acidic Ce4+ Solution
- Versatile Aqueous Chemistry for Selective Ru or WNx Etch and Implant BARC Removal in 5- and 3-nm Applications
- Impact of Controlled Ni Contamination on Silicon Solar Wafer Material
- Wet Processing in State-of-the-Art Cu(In,Ga)(S,Se)2 Thin Film Solar Cells
- Influence of VPT Treatment on Microscopic Distribution of Trace Metal Contaminants and its Effect on TXRF Measurement
- Advanced Data Analysis Strategies for Understanding Particle Contamination in Chemical Distribution Systems
- Determination of HCl Transport Coefficients in Real FOUP Polymers for HCl Cross-Contamination Assessment from FOUP to Wafer
- Yield Enhancement due to Addition of Bevel Cleans at Middle of Line(MOL) Zone