Microelectronics failure analysis : desk reference /

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Bibliographic Details
Edition:	Seventh edition.
Imprint:	Materials Park, Ohio : ASM International, [2019] ©2019
Description:	1 online resource (xi, 705 pages) : illustrations (some color)
Language:	English
Subject:	Electronics -- Materials -- Testing -- Handbooks, manuals, etc. Microelectronics -- Materials -- Testing -- Handbooks, manuals, etc. Microelectronics -- Materials -- Defects -- Handbooks, manuals, etc. Electronic apparatus and appliances -- Testing -- Handbooks, manuals, etc. Semiconductors -- Defects -- Handbooks, manuals, etc. Electronic apparatus and appliances -- Testing. Electronics -- Materials -- Testing. Microelectronics -- Materials -- Defects. Microelectronics -- Materials -- Testing. Semiconductors -- Defects. Handbooks and manuals.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/12649957

Hidden Bibliographic Details
Other authors / contributors:	Gandhi, Tejinder, editor. ASM International, issuing body. Electronic Device Failure Analysis Society, contributor.
ISBN:	9781627082471 1627082476 9781627082464 1627082468 9781523126323 1523126329 9781627082457 162708245X
Notes:	"An ASM materials solutions publication." "EDFAS, Electronic Device Failure Analysis Society, ASM International." Includes bibliographical references and indexes. Print version record.
Other form:	Print version: Microelectronics failure analysis. Seventh edition. Materials Park, Ohio : ASM International, 2019 9781627082457

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