Microelectronics failure analysis : desk reference /
Saved in:
| Edition: | Seventh edition. |
|---|---|
| Imprint: | Materials Park, Ohio : ASM International, [2019] ©2019 |
| Description: | 1 online resource (xi, 705 pages) : illustrations (some color) |
| Language: | English |
| Subject: | |
| Format: | E-Resource Book |
| URL for this record: | http://pi.lib.uchicago.edu/1001/cat/bib/12649957 |
MARC
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| 020 | |z 9781627082457 |q (print) | ||
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| 049 | |a MAIN | ||
| 050 | 4 | |a TK7871 |b .M52 2019 | |
| 245 | 0 | 0 | |a Microelectronics failure analysis : |b desk reference / |c edited by Tejinder Gandhi. |
| 250 | |a Seventh edition. | ||
| 264 | 1 | |a Materials Park, Ohio : |b ASM International, |c [2019] | |
| 264 | 4 | |c ©2019 | |
| 300 | |a 1 online resource (xi, 705 pages) : |b illustrations (some color) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 500 | |a "An ASM materials solutions publication." | ||
| 500 | |a "EDFAS, Electronic Device Failure Analysis Society, ASM International." | ||
| 504 | |a Includes bibliographical references and indexes. | ||
| 505 | 0 | |a Intro; 01_Overview of Wafer-level Electrical Failure_Pai inputs_addressed; 03_EDFAS Desk Reference Paper -- Susan Li -- 8-5-2019 -- Final; 04_Non-destructive Techniques for Advanced Board Level Failure Analysis; 05_EDFAS Desk Refrence -- FA Lab management article-final; 06_07A Optical Microscopy for Desk Reference 2010_corrected; 07_X-ray imaging tools for electronic device failure analysis_CSFinal_V4; 08_!PUB-2019_EDFAS_SAM_Update_Final-20190731; Acoustic Microscopy of Semiconductor Packages; Cheryl D. Hartfield; Carl Zeiss SMT Inc., Pleasanton, CA, USA; cheryl.hartfield@zeiss.com | |
| 505 | 8 | |a Thomas M. MooreWaviks Inc., Dallas, TX, USA; tom.moore@waviks.com; Sebastian Brand; Fraunhofer IMWS, Halle, Germany; sebastian.brand@imws.fraunhofer.de; Introduction; History; The C-scan; The Stanford SAM; Today's SAM for IC Package Inspection; Early SAM Applications in the IC Industry; An Important Tool for Popcorn Crack Detection; Theoretical Considerations; Overview: Acoustic Microscopy for IC Package Inspection; Types of Reflected Signal Analysis Modes:; Polarity Analysis of Reflected Signals; Time of Flight Imaging Using Reflected Signals; Resolution and Sensitivity of SAM Inspection | |
| 505 | 8 | |a Transducer SelectionContrast mechanisms in acoustic imaging; Focusing of acoustic waves; Practical Applications of Conventional SAM; Plastic Package Inspection; Inspection of Packages Having High Velocity Substrates; Strategies for Inspection of Packages Having Thin Layers; Imaging Flip Chip Devices; Complementary Nondestructive Techniques; Current Challenges and New Developments; Stacked Die Packages and Increasing 3D Structures; Signal Analysis in Acoustic Microscopy for Enhanced Defect Detection Capabilities; Spectral Analysis and Split-Spectrum Imaging (SSP); Automated Bump Inspection | |
| 505 | 8 | |a Crack Detection by Multimode and Shear-Wave ImagingExtending Package Inspection Capability with Acoustic Ghz-Microscopy: Potential, Application and Challenges; GHz-SAM Imaging of Wirebond Interfaces and Bond Pads; GHz-SAM for the Inspection of Bonding Interfaces in Wafer Bonding; GHz-SAM Inspection for Void Formation in Metallization Lines for Automotive Applications; Inspection of TSVs Using Acoustic GHz-Microscopy; Photo-acoustic GHz-microscopy: an emerging technique?; Summary; Author Contributions; References; 09_04C Srikanth_Keim_Eide__Diagnosis; 010_aorozco-edfas-deskref-7th-ed-v16 | |
| 505 | 8 | |a 011_TDR_EOTPR_TDT_desk_reference_ASM_r4012_Frontsidefinal_9-3-2019; 013_Backside Preparation and Optics Revision4; 014_Corrected Photon emission article (1); 015_Beam fault isolation corrected; 016_Desk Ref_7thEdition_ Thermal detection_V7_new title_rev1; 017_Desk Ref_7thEdition_3DLIT_V6.1; 018_LADA_SDL_Desk_Reference_Final_Final; 019_Laser Voltage Probing Article -; 020_EDFAS_CAD_Navigation_Principles_7th-Ed; 021_05C MDR_Rosenkranz; 022_EDFAS. Transistor Characterization(Final)_8_30; 023_Fundamentals_Nanoprobe_Final; 024_Silicon Device | |
| 588 | 0 | |a Print version record. | |
| 650 | 0 | |a Electronics |x Materials |x Testing |v Handbooks, manuals, etc. | |
| 650 | 0 | |a Microelectronics |x Materials |x Testing |v Handbooks, manuals, etc. | |
| 650 | 0 | |a Microelectronics |x Materials |x Defects |v Handbooks, manuals, etc. | |
| 650 | 0 | |a Electronic apparatus and appliances |x Testing |v Handbooks, manuals, etc. | |
| 650 | 0 | |a Semiconductors |x Defects |v Handbooks, manuals, etc. | |
| 650 | 7 | |a Electronic apparatus and appliances |x Testing. |2 fast |0 (OCoLC)fst00906837 | |
| 650 | 7 | |a Electronics |x Materials |x Testing. |2 fast |0 (OCoLC)fst00907571 | |
| 650 | 7 | |a Microelectronics |x Materials |x Defects. |2 fast |0 (OCoLC)fst01019772 | |
| 650 | 7 | |a Microelectronics |x Materials |x Testing. |2 fast |0 (OCoLC)fst01019774 | |
| 650 | 7 | |a Semiconductors |x Defects. |2 fast |0 (OCoLC)fst01112211 | |
| 655 | 7 | |a Handbooks and manuals. |2 fast |0 (OCoLC)fst01423877 | |
| 700 | 1 | |a Gandhi, Tejinder, |e editor. |0 http://id.loc.gov/authorities/names/nb2020001654 | |
| 710 | 2 | |a ASM International, |e issuing body. |0 http://id.loc.gov/authorities/names/n86066562 | |
| 710 | 2 | |a Electronic Device Failure Analysis Society, |e contributor. |0 http://id.loc.gov/authorities/names/no99092286 | |
| 776 | 0 | 8 | |i Print version: |t Microelectronics failure analysis. |b Seventh edition. |d Materials Park, Ohio : ASM International, 2019 |z 9781627082457 |w (DLC) 2019951107 |w (OCoLC)1126332918 |
| 903 | |a HeVa | ||
| 929 | |a oclccm | ||
| 999 | f | f | |i e052f20a-9a75-5aa5-8f15-ae4699b42596 |s f145b277-5ec7-58f8-851c-7f782012981d |
| 928 | |t Library of Congress classification |a TK7871 .M52 2019 |l Online |c UC-FullText |u https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=e000xna&AN=2298608 |z eBooks on EBSCOhost |g ebooks |i 12698486 | ||