Hidden Bibliographic Details
| Other authors / contributors: | Kasprzak, Lucian.
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| ISBN: | 9780080575520
0080575528
9780120885749
0120885743
9780128100363
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| Digital file characteristics: | text file
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| Notes: | Includes index.
Machine generated contents note: CH 1 An Overview of Electronic Devices and Their Reliability CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated CH 3 Defects, Contamination and Yield CH 4 The Mathematics of Failure and Reliability CH 5 Mass Transport-Induced Failure Ch 6 Electronic Charge-Induced Damage CH 7 Environmental Damage to Electronic Products CH 8 Packaging Materials, Processes, and Stresses CH 9 Degradation of Contacts and Packages CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices CH 11 Characterization and Failure Analysis of Material, Devices and Packages CH 12 Future Directions and Reliability Issues.
Includes bibliographical references and index.
English.
Print version record.
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| Summary: | "Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"--
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| Other form: | Print version: Ohring, Milton, 1936- Reliability and failure of electronic materials and devices. Second edition 9780120885749
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| Standard no.: | C20090057481
9780120885749
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