Thermal expansion--1973.

Thermal expansion--1973.

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Bibliographic Details
Meeting name:	International Symposium on Thermal Expansion of Solids (1973 : Lake Ozark, Mo.)
Imprint:	New York, American Institute of Physics, 1974.
Description:	304 p. illus. 25 cm.
Language:	English
Series:	AIP conference proceedings no. 17
Subject:	Materials -- Thermal properties -- Congresses. Solids -- Thermal properties -- Congresses. Expansion (Heat) -- Congresses. Expansion (Heat) Materials -- Thermal properties. Solids -- Thermal properties. Conference papers and proceedings.
Format:	Print Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/20982

Hidden Bibliographic Details
Other authors / contributors:	Taylor, R. E. (Raymond Ellory) ed. Denman, G. L., ed. Purdue University. Thermophysical Properties Research Center Air Force Materials Laboratory (U.S.)
ISBN:	0883181169
Notes:	"Under the co-sponsorship of the Thermophysical Properties Research Center, Purdue University, and the Air Force Materials Laboratory, Wright-Patterson Air Force Base, Ohio." Includes bibliographical references.

Crerar, Lower Level, Bookstacks

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Call Number:	TA418.56.I61 1973
c.1	Available Loan period: standard loan Scan and Deliver Request for Pickup Need help? - Ask a Librarian

Crerar, Lower Level, Bookstacks

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Holdings details from Crerar, Lower Level, Bookstacks
Call Number:	TA418.56.I61 1973
c.2	Available Loan period: standard loan Scan and Deliver Request for Pickup Need help? - Ask a Librarian