The Destructive bond pull test /

The Destructive bond pull test /

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Bibliographic Details
Imprint:	[Washington] : U.S. Dept. of Commerce, National Bureau of Standards : for sale by the Supt. of Docs., U.S. Govt. Print. Off., 1976.
Description:	vi, 44 p. : ill. ; 26 cm.
Language:	English
Series:	Semiconductor measurement technology. National Bureau of Standards special publication ; 400-18 NBS special publication 400-18.
Subject:	Aluminum wire -- Testing. Aluminum wire -- Bonding Semiconductors -- Bonding Aluminum wire -- Bonding. Aluminum wire -- Testing. Semiconductors -- Bonding.
Format:	U.S. Federal Government Document Print Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/268842

Hidden Bibliographic Details
Other authors / contributors:	Albers, John.
Notes:	"Jointly supported by: the National Bureau of Standards, the Defense Nuclear Agency, and the Navy Strategic Systems Project Office." Includes bibliographical references.
Govt.docs classification:	C 13.10:400-18

Mansueto

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Holdings details from Mansueto
Call Number:	QC100.U524 no.400-18
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