Silicon micromachining /

Saved in:
Bibliographic Details
Author / Creator:Elwenspoek, M. (Miko), 1948-
Imprint:Cambridge ; New York : Cambridge University Press, 1998.
Description:xiii, 405 p. ; ill. ; 27 cm.
Language:English
Series:Cambridge studies in semiconductor physics and microelectronic engineering ; 7
Subject:
Format: Print Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/4017835
Hidden Bibliographic Details
Other authors / contributors:Jansen, H. (Henri)
ISBN:052159054X (hb)
Notes:Includes bibliographical references and index.

MARC

LEADER 00000pam a2200000 a 4500
001 4017835
003 ICU
005 20030528154900.0
008 971107s1998 enka b 001 0 eng
010 |a  97043732  
020 |a 052159054X (hb) 
035 |a 97043732 
040 |a DLC  |c DLC  |d NhCcYBP  |d NhCcYBP  |d OrLoB-B  |d OCoLC 
050 0 0 |a TK7871.15.S55  |b E49 1998 
082 0 0 |a 621.3815  |2 21 
100 1 |a Elwenspoek, M.  |q (Miko),  |d 1948-  |0 http://id.loc.gov/authorities/names/n97112781  |1 http://viaf.org/viaf/29757674 
245 1 0 |a Silicon micromachining /  |c M. Elwenspoek and H.V. Jansen. 
260 |a Cambridge ;  |a New York :  |b Cambridge University Press,  |c 1998. 
300 |a xiii, 405 p. ;  |b ill. ;  |c 27 cm. 
336 |a text  |b txt  |2 rdacontent  |0 http://id.loc.gov/vocabulary/contentTypes/txt 
337 |a unmediated  |b n  |2 rdamedia  |0 http://id.loc.gov/vocabulary/mediaTypes/n 
338 |a volume  |b nc  |2 rdacarrier  |0 http://id.loc.gov/vocabulary/carriers/nc 
440 0 |a Cambridge studies in semiconductor physics and microelectronic engineering ;  |v 7 
504 |a Includes bibliographical references and index. 
505 0 0 |g 1.  |t Introduction --  |g 2.  |t Anisotropic wet chemical etching --  |g 3.  |t Chemical physics of wet chemical etching --  |g 4.  |t Wafer bonding --  |g 5.  |t Examples and applications --  |g 6.  |t Surface micromachining --  |g 7.  |t Isotropic wet chemical etching of silicon --  |g 8.  |t Introduction into dry plasma etching in microtechnology --  |g 9.  |t Why plasmas? --  |g 10.  |t What is plasma etching? --  |g 11.  |t Plasma system configurations --  |g 12.  |t Contact plasma etching --  |g 13.  |t Remote plasma etching --  |g 14.  |t High aspect ratio trench etching --  |g 15.  |t Moulding of microstructures --  |g 16.  |t Fabrication of movable microstructures. 
650 0 |a Silicon.  |0 http://id.loc.gov/authorities/subjects/sh85122512 
650 0 |a Micromachining.  |0 http://id.loc.gov/authorities/subjects/sh96011311 
650 0 |a Etching.  |0 http://id.loc.gov/authorities/subjects/sh00005643 
650 7 |a Etching.  |2 fast  |0 http://id.worldcat.org/fast/fst00915741 
650 7 |a Micromachining.  |2 fast  |0 http://id.worldcat.org/fast/fst01019888 
650 7 |a Silicon.  |2 fast  |0 http://id.worldcat.org/fast/fst01118631 
700 1 |a Jansen, H.  |q (Henri) 
901 |a ToCBNA 
903 |a Hathi 
903 |a HeVa 
035 |a (OCoLC)37955505 
929 |a cat 
999 f f |i de132b91-2d22-51fe-8167-994b9ba15ead  |s d0a61ba4-2ce2-5381-8345-395d9a505a58 
928 |t Library of Congress classification  |a TK7871.15.S55E49 1998  |l JCL  |c JCL-Sci  |i 4369144 
927 |t Library of Congress classification  |a TK7871.15.S55E49 1998  |l JCL  |c JCL-Sci  |e CRERAR  |b 51086496  |i 6481248